Our Assistant professor in Cyber Security Dr Tianxiang Dai had the pleasure of attending the 10th IEEE 6G Summit and the inaugural IEEE Chips Summit in Dresden. He was honoured to serve as programme co-chair for the Chips Summit.
It was an engaging event, featuring a diverse range of sessions on semiconductor systems—from design through to applications—as well as an outstanding demo area and impressive startup pitches. They were delighted to welcome around 450 participants to this inspiring gathering.
Visit the event page here:
https://chipssummit.org
All photos ©5G Lab GmbH / Marcus Hartelt.
